The Chinese expression “接触窗” can be translated into the English “Contact holes” and other terms. A translation guide for various contexts is provided below.
Contexts
Semiconductors
Translation Equivalents
- Contact holes
Evidence for Translation Approach
According to a representative patent by TSMC :
“本发明提供了一种用于三维集成电路的半导体装置结构.半导体装置结构包含:具有第一表面及第二表面的基板,定义于基板且自第一表面延伸至第二表面的介层,以及位于第一表面且与介层接触之多个第一接触窗结构。”
According to a representative patent by Philips Corporation:
“A method of manufacturing a semiconductor device comprising a silicon substrate and a dielectric layer which is provided thereon and in which contact holes are etched down to the silicon, after which palladium nuclei are provided in the contact holes and, next, metal plugs are formed in said contact holes by means of an electroless metallization bath, which plugs contact the silicon, characterized in that a stabilizer is added to the electroless metallization bath and in that, prior to the electroless metallization of the contract holes, the silicon of said contact holes is provided with a TiW layer, after which at least said TiW layer is provided with palladium nuclei.”